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R2: Precision Redefined in Microelectronics Fabrication

Proudly the only U.S.-produced pulsed laser instrument, R2 sets the standard for advanced microelectronics fabrication and semiconductor packaging.

High-accuracy microfluidic devices

Wafer-dicing

US-based

CTA

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What We Deliver

R2 is the next-generation pulsed laser instrument designed to revolutionize microelectronics fabrication and semiconductor advanced packaging. Engineered for unparalleled precision and efficiency, R2 delivers cutting-edge solutions tailored to the demands of modern manufacturing.

Why Choose R2 Industries

dicing ultra-thin wafers

We continuously invest in cutting-edge manufacturing technology to ensure superior quality and efficiency in our semiconductor production processes.

un-bonding temporarily bonded wafers

Our team works closely with clients to develop tailored semiconductor solutions that meet their specific requirements and exceed their expectations.

dicing delicate MEMS devices

We utilize durable, high-quality materials to ensure the longevity and performance of our semiconductor products.

Expert Advisory Services

Our experienced advisors provide valuable insights and guidance throughout the semiconductor manufacturing process, from design to deployment.

Discover Our Capabilities

Our Partners

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R2 INDUSTRIES

Advanced laser systems

Contact

4220 Sarpy Ave

Saint Louis, MO 63110

www.r2industries.com​

Copyright  2025 ©R2 Industries All Rights Reserved 

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